Eric Chason is a professor in the Division of Engineering at Brown University. He received his Ph.D. in physics from Harvard University in 1985, after which he performed post-doctoral work at Gakushuin University, Tokyo and was a staff member at Sandia National Laboratories in Albuquerque. His research has focused on the evolution of surfaces and thin films during materials processing. Part of this work has involved the development of real-time in situ thin film diagnostics for measuring film stress, morphology and microstructure. He has taught the course Introduction to Materials Science as well as graduate and undergraduate courses on kinetic processes in materials, crystallography, electronic materials and thin film materials. He is an active member of the American Physical Society and Materials Research Society.
|Chason, Eric, Engwall, A. M., Rao, Z., Nishimura, T. Kinetic model for thin film stress including the effect of grain growth. Journal of Applied Physics/J. Appl. Phys.. 2018; 123 (18) : 185305.|
|Abadias, Grégory, Chason, Eric, Keckes, Jozef, Sebastiani, Marco, Thompson, Gregory B., Barthel, Etienne, Doll, Gary L., Murray, Conal E., Stoessel, Chris H., Martinu, Ludvik Review Article: Stress in thin films and coatings: Current status, challenges, and prospects. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films/Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 2018; 36 (2) : 020801.|
|Fortier, Aleksandra, Liu, Yue, Ghamarian, Iman, Collins, Peter C., Chason, Eric Investigation of Tin (Sn) Film Using an Aerosol Jet Additive Manufacturing Deposition Process. Journal of Electronic Materials/Journal of Electronic Materials. 2017; 46 (8) : 5174-5182.|
|Chen, Chun-Hao, Chason, Eric, Guduru, Pradeep R. Measurements of the Phase and Stress Evolution during Initial Lithiation of Sn Electrodes. Journal of The Electrochemical Society/Journal of The Electrochemical Society. 2017; 164 (4) : A574-A579.|
|Chen, Chun-Hao, Chason, Eric, Guduru, Pradeep R. Numerical Solution of Moving Phase Boundary and Diffusion-Induced Stress of Sn Anode in the Lithium-Ion Battery. Journal of The Electrochemical Society/Journal of The Electrochemical Society. 2017; 164 (11) : E3661-E3670.|
|Chason, Eric, Vasquez, Justin, Pei, Fei, Jain, Nupur, Hitt, Andrew Quantifying the Effect of Stress on Sn Whisker Nucleation Kinetics. Journal of Electronic Materials/Journal of Electronic Materials. 2017; 47 (1) : 103-109.|
|Pei, Fei, Buchovecky, Eric, Bower, Allan, Chason, Eric Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments. Acta Materialia/Acta Materialia. 2017; 129 : 462-473.|
|Hulikal, Srivatsan, Chen, Chun-Hao, Chason, Eric, Bower, Allan Experimental Calibration of a Cahn-Hilliard Phase-Field Model for Phase Transformations in Li-Sn Electrodes. Journal of The Electrochemical Society/Journal of The Electrochemical Society. 2016; 163 (13) : A2647-A2659.|
|Pei, Fei, Jadhav, Nitin, Buchovecky, Eric, Bower, Allan F., Chason, Eric, Liu, Wenjun, Tischler, Jonathan Z., Ice, Gene E., Xu, Ruqing In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation. J. Appl. Phys.. 2016; 119 (10) : 105302.|
|Chason, Eric, Guduru, Pradeep R. Tutorial: Understanding residual stress in polycrystalline thin films through real-time measurements and physical models. J. Appl. Phys.. 2016; 119 (19) : 191101.|
|Bower, Allan F., Guduru, Pradeep R., Chason, Eric Analytical solutions for composition and stress in spherical elastic–plastic lithium-ion electrode particles containing a propagating phase boundary. International Journal of Solids and Structures. 2015; 69-70 : 328-342.|
|Pei, Fei, Bower, Allan F., Chason, Eric Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress. Journal of Electronic Materials. 2015; 45 (1) : 21-29.|
|Chason, Eric, Engwall, Alison M. Relating residual stress to thin film growth processes via a kinetic model and real-time experiments. Thin Solid Films. 2015;|
|Chason, E., Engwall, A.M., Miller, C.M., Chen, C.-H., Bhandari, A., Soni, S.K., Hearne, S.J., Freund, L.B., Sheldon, B.W. Stress evolution during growth of 1-D island arrays: Kinetics and length scaling. Scripta Materialia. 2015; 97 : 33-36.|
|Chason, E., Shin, J. W., Chen, C.-H., Engwall, A. M., Miller, C. M., Hearne, S. J., Freund, L. B. Growth of patterned island arrays to identify origins of thin film stress. J. Appl. Phys.. 2014; 115 (12) : 123519.|
|Benz, Mark G., Benz, Matthew W., Birnbaum, Steven B., Chason, Eric, Sheldon, Brian W., McGuire, Dale Improved spatial resolution and lower-dose pediatric CT imaging: a feasibility study to evaluate narrowing the X-ray photon energy spectrum. Pediatr Radiol. 2014; 44 (8) : 1026-1030.|
|Pei, F., Briant, C.L., Kesari, H., Bower, A.F., Chason, E. Kinetics of Sn whisker nucleation using thermally induced stress. Scripta Materialia. 2014; 93 : 16-19.|
|Chason, E., Pei, F., Briant, C. L., Kesari, H., Bower, A. F. Significance of Nucleation Kinetics in Sn Whisker Formation. Journal of Electronic Materials. 2014; 43 (12) : 4435-4441.|
|Ishii, Yohei, Madi, Charbel S., Aziz, Michael J., Chason, Eric Stress evolution in Si during low-energy ion bombardment. Journal of Materials Research. 2014; 29 (24) : 2942-2948.|
|Li, Meifang, Hannon, James B., Tromp, Rudoff M., Sun, Jiebing, Li, Junwen, Shenoy, Vivek B., Chason, Eric Equilibrium shape of graphene domains on Ni(111). Physical Review B. 2013; 88 (4)|
|Chason, Eric, Jadhav, Nitin, Pei, Fei, Buchovecky, Eric, Bower, Allan Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms. Progress in Surface Science. 2013; 88 (2) : 103-131.|
|Pei, Fei, Chason, Eric In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers. Journal of Electronic Materials. 2013; 43 (1) : 80-87.|
|Sen, S., Kim, S., Jin, S., Palmore, L. R., Jadhav, N., Chason, E., Palmore, G. T. R. In Situ Measurement of Stress Evolution and Ion Dynamics in Conducting Polymers. ECS Transactions. 2013; 45 (22) : 15-21.|
|Chason, E., Engwall, A., Pei, F., Lafouresse, M., Bertocci, U., Stafford, G., Murphy, J. A., Lenihan, C., Buckley, D. N. Understanding Residual Stress in Electrodeposited Cu Thin Films. Journal of The Electrochemical Society. 2013; 160 (12) : D3285-D3289.|
|Chason, Eric A kinetic analysis of residual stress evolution in polycrystalline thin films. Thin Solid Films. 2012; 526 : 1-14.|
|Jadhav, Nitin, Williams, Maureen, Pei, Fei, Stafford, Gery, Chason, Eric Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers. Journal of Electronic Materials. 2012; 42 (2) : 312-318.|
|Pei, Fei, Jadhav, Nitin, Chason, Eric Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization. Appl. Phys. Lett.. 2012; 100 (22) : 221902.|
|Pei, Fei, Jadhav, Nitin, Chason, Eric Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu. JOM. 2012; 64 (10) : 1176-1183.|
|Chason, E., Shin, J. W., Hearne, S. J., Freund, L. B. Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure. J. Appl. Phys.. 2012; 111 (8) : 083520.|
|Ishii, Yohei, Chan, Wai Lun, Chason, Eric Kinetic Monte Carlo simulation of ripple formation by sputtering: Effects of multiple defects and Ehrlich–Schwoebel barriers. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2012; 272 : 188-192.|
|Kim, S.-P., Chew, H. B., Chason, E., Shenoy, V. B., Kim, K.-S. Nanoscale mechanisms of surface stress and morphology evolution in FCC metals under noble-gas ion bombardments. Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences. 2012; 468 (2145) : 2550-2573.|
|Chason, Eric, Shenoy, Vivek Surface nanopatterning mechanisms by keV ions: Linear instability models and beyond. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2012; 272 : 178-182.|
|Chason, Eric, Jadhav, Nitin, Pei, Fei Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation. JOM. 2011; 63 (10) : 62-68.|
|Jadhav, Nitin, Wasserman, Jacob, Pei, Fei, Chason, Eric Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure. Journal of Electronic Materials. 2011; 41 (3) : 588-595.|
|Xu, Hongwei, Alford, Craig, Chason, Eric, Detor, Andrew J., Fuller, Tim, Hamza, Alex V., Hayes, Jeff, Moreno, Kari A., Nikroo, Abbas, van Buuren, Tony, Wang, Yinmin, Wu, Jun-jim, Wilkens, Heather, Youngblood, Kelly P. Thick beryllium coatings by ion-assisted magnetron sputtering. Journal of Materials Research. 2011; 27 (05) : 822-828.|
|Bhandakkar, Tanmay K., Chason, Eric, Gao, Huajian Analytical model of transient compressive stress evolution during growth of high diffusivity thin films on substrates. Philosophical Magazine. 2010; 90 (22) : 3037-3048.|
|Navid, A.A., Chason, E., Hodge, A.M. Evaluation of stress during and after sputter deposition of Cu and Ta films. Surface and Coatings Technology. 2010; 205 (7) : 2355-2361.|
|Jadhav, Nitin, Buchovecky, Eric, Chason, Eric, Bower, Allan Real-time SEM/FIB studies of whisker growth and surface modification. JOM. 2010; 62 (7) : 30-37.|
|Yang, Yi, Huang, Hanchen, Xiang, S. K., Chason, Eric Stress control in polycrystalline thin films—reduction in adatoms diffusion into grain boundaries via surfactants. Appl. Phys. Lett.. 2010; 96 (21) : 211903.|
|Zepeda-Ruiz, Luis A., Gilmer, George H., Walton, Christopher C., Hamza, Alex V., Chason, Eric Surface morphology evolution during sputter deposition of thin films – lattice Monte Carlo simulations. Journal of Crystal Growth. 2010; 312 (8) : 1183-1187.|
|Jadhav, Nitin, Buchovecky, Eric J., Reinbold, Lucine, Kumar, Sharvan, Bower, Allan F., Chason, Eric Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation. IEEE Transactions on Electronics Packaging Manufacturing. 2010; 33 (3) : 183-192.|
|Shin, Jae Wook, Chason, Eric Compressive Stress Generation in Sn Thin Films and the Role of Grain Boundary Diffusion. Phys. Rev. Lett.. 2009; 103 (5)|
|Buchovecky, Eric, Jadhav, Nitin, Bower, Allan F., Chason, Eric Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound. Journal of Electronic Materials. 2009; 38 (12) : 2676-2684.|
|BHANDAKKAR, TANMAY K., CHASON, ERIC, GAO, HUAJIAN FORMATION OF CRACK-LIKE DIFFUSION WEDGES AND COMPRESSIVE STRESS EVOLUTION DURING THIN FILM GROWTH WITH INHOMOGENEOUS GRAIN BOUNDARY DIFFUSIVITY. Int. J. Appl. Mechanics. 2009; 01 (01) : 1-19.|
|Chason, E, Chan, W L Kinetic Monte Carlo simulations compared with continuum models and experimental properties of pattern formation during ion beam sputtering. Journal of Physics: Condensed Matter. 2009; 21 (22) : 224016.|
|Reinbold, Lucine, Jadhav, Nitin, Chason, Eric, Sharvan Kumar, K. Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn–Cu “bimetal ledge specimen”. Journal of Materials Research. 2009; 24 (12) : 3583-3589.|
|Chason, Eric, Chan, Wai Lun Spontaneous Patterning of Surfaces by Low-Energy Ion Beams. Topics in Applied Physics. 2009; : 53-71.|
|Detor, Andrew J., Hodge, Andrea M., Chason, Eric, Wang, Yinmin, Xu, Hongwei, Conyers, Mark, Nikroo, Abbas, Hamza, Alex Stress and microstructure evolution in thick sputtered films. Acta Materialia. 2009; 57 (7) : 2055-2065.|
|Shin, Jae Wook, Chason, Eric Stress behavior of electroplated Sn films during thermal cycling. Journal of Materials Research. 2009; 24 (04) : 1522-1528.|
|Medhekar, N V, Chan, W L, Shenoy, V B, Chason, E Stress-enhanced pattern formation on surfaces during low energy ion bombardment. Journal of Physics: Condensed Matter. 2009; 21 (22) : 224021.|
|Zepeda-Ruiz, Luis A., Chason, Eric, Gilmer, George H., Wang, Yinmin, Xu, Hongwei, Nikroo, Abbas, Hamza, Alex V. Understanding the relation between stress and surface morphology in sputtered films: Atomistic simulations and experiments. Appl. Phys. Lett.. 2009; 95 (15) : 151910.|
|Kumar, K.S., Reinbold, L., Bower, A.F., Chason, E. Plastic deformation processes in Cu/Sn bimetallic films. Journal of Materials Research. 2008; 23 (11) : 2916-2934.|
|Chan, Wai Lun, Chason, Eric Stress evolution and defect diffusion in Cu during low energy ion irradiation: Experiments and modeling. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 2008; 26 (1) : 44.|
|Chason, E., Jadhav, N., Chan, W. L., Reinbold, L., Kumar, K. S. Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes. Appl. Phys. Lett.. 2008; 92 (17) : 171901.|
|Shenoy, V. B., Chan, W. L., Chason, E. Compositionally Modulated Ripples Induced by Sputtering of Alloy Surfaces. Phys. Rev. Lett.. 2007; 98 (25)|
|Shin, Jae Wook, Standley, Adam, Chason, Eric Epitaxial electrodeposition of freestanding large area single crystal substrates. Appl. Phys. Lett.. 2007; 90 (26) : 261909.|
|Tello, Juan S., Bower, Allan F., Chason, Eric, Sheldon, Brian W. Kinetic Model of Stress Evolution during Coalescence and Growth of Polycrystalline Thin Films. Phys. Rev. Lett.. 2007; 98 (21)|
|Chason, Eric, Chan, Wai Lun Kinetic phase diagram for morphological evolution on Cu(001) surfaces during ion bombardment. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2007; 256 (1) : 305-312.|
|Chan, Wai Lun, Chason, Eric Making waves: Kinetic processes controlling surface evolution during low energy ion sputtering. J. Appl. Phys.. 2007; 101 (12) : 121301.|
|Maekawa, Y., Sato, K., Chason, E., Mizoguchi, T. Orientation of Nano-Grains in Hard-Disk Media on Ion-Beam Textured Substrates. IEEE Trans. Magn.. 2007; 43 (6) : 2169-2171.|
|Chan, Wai Lun, Chason, Eric, Iamsumang, C. Surface stress induced in Cu foils during and after low energy ion bombardment. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2007; 257 (1-2) : 428-432.|
|Chason, Eric, Chan, Wai Lun Kinetic mechanisms in ion-induced ripple formation on Cu(001) surfaces. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2006; 242 (1-2) : 232-236.|
|Chason, E., Chan, W. L., Bharathi, M. S. Kinetic Monte Carlo simulations of ion-induced ripple formation: Dependence on flux, temperature, and defect concentration in the linear regime. Physical Review B. 2006; 74 (22)|
|Lynch, C., Chason, E., Beresford, R. Mobile dislocation density and strain relaxation rate evolution during In[sub x]Ga[sub 1−x]As∕GaAs heteroepitaxy. J. Appl. Phys.. 2006; 100 (1) : 013525.|
|Chan, Wai Lun, Chason, Eric Morphology of ion sputtered Cu(001) surface: Transition from unidirectional roughening to bidirectional roughening. Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 2006; 242 (1-2) : 228-231.|
|Sheldon, Brian W., Rajamani, Ashok, Bhandari, Abhinav, Chason, Eric, Hong, S. K., Beresford, R. Competition between tensile and compressive stress mechanisms during Volmer-Weber growth of aluminum nitride films. J. Appl. Phys.. 2005; 98 (4) : 043509.|
|Lynch, C., Chason, E., Beresford, R. Enhanced strain relaxation rate of InGaAs by adatom-assisted dislocation kink nucleation. J. Vac. Sci. Technol. B. 2005; 23 (3) : 1166.|
|Lynch, C., Chason, E., Beresford, R., Freund, L. B., Tetz, K., Schwarz, K. W. Limits of strain relaxation in InGaAs∕GaAs probed in real time by in situ wafer curvature measurement. J. Appl. Phys.. 2005; 98 (7) : 073532.|
|Chan, Wai Lun, Chason, Eric Sputter ripples and radiation-enhanced surface kinetics on Cu(001). Physical Review B. 2005; 72 (16)|
|Brown, Ari-David, Erlebacher, Jonah, Chan, Wai-Lun, Chason, Eric Transient Topographies of Ion Patterned Si(111). Phys. Rev. Lett.. 2005; 95 (5)|
|Lynch, C., Chason, E., Beresford, R., Hong, S. K. Influence of growth flux and surface supersaturation on InGaAs/GaAs strain relaxation. Appl. Phys. Lett.. 2004; 84 (7) : 1085.|
|Shenoy, V. B., Ramasubramaniam, A., Ramanarayan, H., Tambe, D. T., Chan, W-L., Chason, E. Influence of Step-Edge Barriers on the Morphological Relaxation of Nanoscale Ripples on Crystal Surfaces. Phys. Rev. Lett.. 2004; 92 (25)|
|Chan, Wai Lun, Pavenayotin, Niravun, Chason, Eric Kinetics of ion-induced ripple formation on Cu(001) surfaces. Physical Review B. 2004; 69 (24)|
|Lynch, C., Beresford, R., Chason, E. Real-time stress evolution during growth of In[sub x]Al[sub 1−x]As/GaAs metamorphic buffer layers. J. Vac. Sci. Technol. B. 2004; 22 (3) : 1539.|
|Chan, Wai Lun, Ramasubramaniam, Ashwin, Shenoy, Vivek B., Chason, Eric Relaxation kinetics of nano-ripples on Cu(001) surface. Physical Review B. 2004; 70 (24)|
|Horn, K. M., Tsao, J. Y., Chason, E., Brice, D. K., Picraux, S. T. Hydrogen ion beam smoothening of Ge(001). J. Appl. Phys.. 1991; 69 (1) : 243.|
|Chason, E., Tsao, J.Y. Adatoms, strings and epitaxy on singular surfaces. Surface Science. 1990; 234 (3) : 361-370.|
|Chason, E., Greer, A. L., Kelton, K. F., Pershan, P. S., Sorensen, L. B., Spaepen, F., Weiss, A. H. Structural relaxation of amorphous Pd 82 Si 18 : X-ray measurements, electrical-resistivity measurements, and a comparison using the Ziman theory . Physical Review B. 1985; 32 (6) : 3399-3408.|
Professor Chason's research focuses on the evolution of thin films and surfaces, including the development of in situ diagnostics to monitor changes in stress and morphology as they occur. Recent studies involve residual stress during thin film growth, whisker formation in Sn coatings, and self-organized pattern formation during ion sputtering. This work includes experiments, computer simulation, and development of models to relate the experimental results to fundamental materials processes.
More information about our research can be found at our lab website (http://www.brown.edu/Departments/Engineering/Labs/Chason/research/index.html).
Professor Chason's primary research interest is the evolution of thin films and surfaces during processing. As the dimensions of advanced device structures continue to decrease, it becomes increasingly important to understand how thin films develop in order to precisely control their structure and properties. A major aspect of this research has been the development of in situ diagnostics that enable the changes in morphology and microstructure to be monitored as they occur.
Recent work has focused on 1) the development of residual stress during thin film growth; 2) the processes controlling the formation of whiskers in Sn coatings; 3) evolution of self-organized surface patterns during low energy ion sputtering; and 4) stress relaxation in heteroepitaxial layers via dislocations and islanding. This work includes experimental measurements, computer simulation of film growth and sputtering, and development of models to relate the experimental results to fundamental materials processes.
Research techniques developed include a multi-beam optical sensor (MOSS) for measuring wafer curvature (proportional to film stress) during growth in ultra-high vacuum and other environments. In addition, a novel in situ spectroscopic light scattering technique allows the measurements of surface morphology without interrupting processing. In situ x-ray reflectivity has also been developed in order to study surface roughness and buried interfaces during growth, annealing, and low energy ion sputtering.
More information about our research can be found at our lab website (http://www.brown.edu/Departments/Engineering/Labs/Chason/research/index.html).
KINETIC MECHANISMS IN ION-INDUCED RIPPLE FORMATION ON CU(001) SURFACES, E. Chason, W.L. Chan, Nucl. Instr. Meth. B 242, 232 (2006).
INFLUENCE OF GROWTH FLUX AND SURFACE SUPERSATURATION ON InGaAs/GaAs STRAIN RELAXATION, C. Lynch, E. Chason, R. Beresford, S.K. Hong, App. Phys. Lett., 84 , 1085 (2004).
ORIGIN OF COMPRESSIVE RESIDUAL STRESS IN POLYCRYSTALLINE THIN FILMS, E. Chason, B.W. Sheldon, L.B. Freund, J.A. Floro, S.J. Hearne, Phys. Rev. Lett. 88, 156103 (2002).
"CURVATURE BASED TECHNIQUES FOR REAL-TIME STRESS MEASUREMENTS DURING THIN FILM GROWTH", J.A. Floro and E. Chason, in In Situ Characterization of Thin Film Growth Processes, A. Krauss and O. Auciello, eds., (John Wiley and Sons, New York, 2000) pp. 191-216.
SPONTANEOUS PATTERN FORMATION ON ION-BOMBARDED SI(001), J. Erlebacher, M.J. Aziz, E. Chason, M.B. Sinclair and J.A. Floro, Phys. Rev. Lett. 82, 2330 (1999).
STRESS EVOLUTION DURING METAL-ORGANIC CHEMICAL VAPOR DEPOSITION OF GaN, S. Hearne, E. Chason, J. Han, J.A. Floro, J. Fiegel, J. Hunter, H. Amano and I. Tsong, Appl. Phys. Lett. 74, 356 (1999).
SiGe ISLAND SHAPE TRANSITIONS INDUCED BY ELASTIC REPULSION, J.A. Floro, G.A. Lucadomo, E. Chason, L.B. Freund, M. Sinclair, R.D. Twesten, R.Q. Hwang, Phys. Rev. Lett. 80, 4717 (1998).
SPECTROSCOPIC LIGHT SCATTERING MEASUREMENTS FOR REAL TIME MEASUREMENTS OF THIN FILM AND SURFACE EVOLUTION, E. Chason, M.B. Sinclair, J.A. Floro, J.A. Hunter and R.Q. Hwang, Appl. Phys. Lett. 72, (1998).
THIN FILM AND SURFACE CHARACTERIZATION USING SPECULAR X-RAY REFLECTIVITY, E. Chason and T.M. Mayer, CRC Critical Reviews in Materials and Solid State Science 22, 1 (1997).
SiGe COHERENT ISLANDING AND STRESS RELAXATION IN THE HIGH MOBILITY REGIME, J. A. Floro, E. Chason, R. D. Twesten, R. Q. Hwang, and L. B. Freund, Physical Review Letters 79, 3946 (1997).
ROUGHENING INSTABILITY AND EVOLUTION OF Ge(001) SURFACE DURING ION SPUTTERING, E. Chason, T.M. Mayer, B.K. Kellerman, D.T. McIlroy and A.J. Howard, Phys. Rev. Lett. 72, 3040 (1994).
ROUGHENING INSTABILITY AND ION-INDUCED VISCOUS RELAXATION OF SiO2 SURFACES, T.M. Mayer, E. Chason and A.J. Howard, J. Appl. Phys. 76, 1633 (1994).
1994 DOE-BES Award for Sustained Outstanding Research in Metallurgy and Ceramics
Sandia National Labs Awards for Excellence (1991, 1994, 1996, 1997, 1998)
Phi Beta Kappa
TMS, 2019 Functional Materials Division John Bardeen Award
American Physical Society (past member of executive committee, Division of Materials Physics)
Materials Research Society
|ENGN 0410 - Materials Science|
|ENGN 1420 - Kinetics Processes in Materials Science and Engineering|
|ENGN 2420 - Kinetic Processes and Mechanisms in Materials Science|
|ENGN 2490A - Crystal Structures and Crystallography|